Heat dissipation device with communication function

ABSTRACT

A heat dissipation device with a function of communication includes a conductive substrate, a first conductive sidewall, a second conductive sidewall, a plurality of heat sink elements, and a feeding element. The heat sink elements have different lengths, and they are positioned between the first conductive sidewall and the second conductive sidewall. The first conductive sidewall, the heat sink elements, and the second conductive sidewall are respectively coupled to the conductive substrate. The feeding element is coupled to a signal source. An antenna structure is formed by the feeding element, the conductive substrate, and the heat sink elements.

BACKGROUND OF THE INVENTION Field of the Invention

The disclosure generally is related to a heat dissipation device, andmore particularly, it is related to a heat dissipation device with acommunication function.

Description of the Related Art

With the advancements being made in mobile communication technology,mobile devices such as portable computers, mobile phones, multimediaplayers, and other hybrid functional portable electronic devices havebecome more common. To satisfy user demand, mobile devices can usuallyperform wireless communication functions. Some devices cover a largewireless communication area; these include mobile phones using 2G, 3G,and LTE (Long Term Evolution) systems and using frequency bands of 700MHz, 850 MHz, 900 MHz, 1800 MHz, 1900 MHz, 2100 MHz, 2300 MHz, 2500 MHz,and 2700 MHz. Some devices cover a small wireless communication area;these include mobile phones using Wi-Fi and Bluetooth systems and usingfrequency bands of 2.4 GHz, 5.2 GHz, and 5.8 GHz.

Antennas are indispensable elements of mobile devices supportingwireless communication. However, since mobile devices and HMDs (HeadMounted Display) of VR, AR, MR, etc., have limited inner space, theycannot accommodate antenna elements with large sizes. Accordingly, thereis a need to propose a novel solution for solving the problems of theprior art.

BRIEF SUMMARY OF THE INVENTION

In an exemplary embodiment, the disclosure is directed to a heatdissipation device with a function of communication. The heatdissipation device includes a conductive substrate, a first conductivesidewall, a second conductive sidewall, a plurality of heat sinkelements, and a feeding element. The heat sink elements have differentlengths, and they are positioned between the first conductive sidewalland the second conductive sidewall. The first conductive sidewall, theheat sink elements, and the second conductive sidewall are respectivelycoupled to the conductive substrate. The feeding element is coupled to asignal source. An antenna structure is formed by the feeding element,the conductive substrate, and the heat sink elements.

In some embodiments, the first conductive sidewall, the heat sinkelements, and the second conductive sidewall are substantiallyperpendicular to the conductive substrate.

In some embodiments, the first conductive sidewall, the heat sinkelements, and the second conductive sidewall are substantially parallelto each other.

In some embodiments, the first conductive sidewall, the heat sinkelements, and the second conductive sidewall define a plurality of openslots with different lengths.

In some embodiments, each of the open slots has an open end and a closedend.

In some embodiments, the open slots are excited to generate a pluralityof resonant modes with different frequencies, so that the antennastructure is capable of covering wideband operations.

In some embodiments, the feeding element directly touches one or more ofthe heat sink elements.

In some embodiments, the feeding element is adjacent to but does notdirectly touch one or more of the heat sink elements.

In some embodiments, the heat dissipation device further includes aconductive ramp element disposed on the conductive substrate. Theconductive ramp element is configured to support the heat sink elements,so that the terminals of the heat sink elements are aligned with eachother.

In some embodiments, each of the heat sink elements substantially has aU-shape.

In some embodiments, each of the heat sink elements has a notch.

In some embodiments, each of the notches substantially has a rectangularshape.

In some embodiments, the notches of the heat sink elements aresubstantially arranged in the same straight line.

In some embodiments, the heat dissipation device is applicable to an HMD(Head Mount Display) supporting VR (Virtual Reality), AR (AugmentedReality) or MR (Mixed Reality).

In some embodiments, the antenna structure covers a first frequency bandand a second frequency band. The first frequency band is from 2400 MHzto 2500 MHz. The second frequency band is from 3100 MHz to 7125 MHz.

In some embodiments, the antenna structure further includes at least oneof the first conductive sidewall and the second conductive sidewall.

In some embodiments, the lengths of the heat sink elements are shorterthan or equal to the lengths of the first conductive sidewall and thesecond conductive sidewall.

In some embodiments, terminals of the heat sink elements, a firstterminal of the first conductive sidewall, and a second terminal of thesecond conductive sidewall are aligned with each other and arepositioned on the same plane.

BRIEF DESCRIPTION OF DRAWINGS

The invention can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1A is a perspective view of a heat dissipation device according toan embodiment of the invention;

FIG. 1B is a sectional view of a heat dissipation device according to anembodiment of the invention;

FIG. 2A is a perspective view of a heat dissipation device according toan embodiment of the invention;

FIG. 2B is a sectional view of a heat dissipation device according to anembodiment of the invention;

FIG. 2C is a sectional view of a heat dissipation device according to anembodiment of the invention;

FIG. 2D is a diagram of resonant paths of an antenna structure of a heatdissipation device according to an embodiment of the invention;

FIG. 3A is a diagram of a direct excitation mechanism of an antennastructure according to an embodiment of the invention;

FIG. 3B is a diagram of a coupling excitation mechanism of an antennastructure according to an embodiment of the invention;

FIG. 4A is a diagram of return loss of an antenna structure of a heatdissipation device according to an embodiment of the invention;

FIG. 4B is a diagram of radiation efficiency of an antenna structure ofa heat dissipation device according to an embodiment of the invention;

FIG. 5A is a perspective view of an HMD (Head Mounted Display) accordingto an embodiment of the invention;

FIG. 5B is a perspective view of a heat dissipation portion of an HMDaccording to an embodiment of the invention;

FIG. 6 is a sectional view of a heat dissipation device according to anembodiment of the invention; and

FIG. 7 is a sectional view of a heat dissipation device according to anembodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

In order to illustrate the purposes, features and advantages of theinvention, the embodiments and figures of the invention are shown indetail below.

Certain terms are used throughout the description and following claimsto refer to particular components. As one skilled in the art willappreciate, manufacturers may refer to a component by different names.This document does not intend to distinguish between components thatdiffer in name but not function. In the following description and in theclaims, the terms “include” and “comprise” are used in an open-endedfashion, and thus should be interpreted to mean “include, but notlimited to . . . ”. The term “substantially” means the value is withinan acceptable error range. One skilled in the art can solve thetechnical problem within a predetermined error range and achieve theproposed technical performance. Also, the term “couple” is intended tomean either an indirect or direct electrical connection. Accordingly, ifone device is coupled to another device, that connection may be througha direct electrical connection, or through an indirect electricalconnection via other devices and connections.

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Furthermore, spatially relative terms, such as “beneath,” “below,”“lower,” “above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

FIG. 1A is a perspective view of a heat dissipation device 100 accordingto an embodiment of the invention. FIG. 1B is a sectional view of theheat dissipation device 100 according to an embodiment of the invention(along a sectional line LC1). Please refer to FIG. 1A and FIG. 1Btogether. The heat dissipation device 100 may be applied to a mobiledevice, such as an HMD (Head Mounted Display), a smartphone, a tabletcomputer, or a notebook computer. In the embodiment of FIG. 1A and FIG.1B, the heat dissipation device 100 at least includes a conductivesubstrate 110, a first conductive sidewall 121, a second conductivesidewall 122, a plurality of heat sink elements 130, 140, 150, 160, 170and 180, and a feeding element 190. All of the above elements may bemade of metal materials. It should be understood that the heatdissipation device 100 may further include other components, such as aconnection element and/or a housing, although they are not displayed inFIG. 1A and FIG. 1B.

The number of heat sink elements 130, 140, 150, 160, 170 and 180 is notlimited in the invention. In other embodiments, the heat dissipationdevice 100 may include more or fewer heat sink elements. The heat sinkelements 130, 140, 150, 160, 170 and 180 have different lengths, andthey are all positioned between the first conductive sidewall 121 andthe second conductive sidewall 122. In some embodiments, the length ofeach of the heat sink elements 130, 140, 150, 160, 170 and 180 isshorter than or equal to the length of each of the first conductivesidewall 121 and the second conductive sidewall 122. The firstconductive sidewall 121, the heat sink elements 130, 140, 150, 160, 170and 180, and the second conductive sidewall 122 are respectively coupledto the conductive substrate 110. An antenna structure is formed by thefeeding element 190, the conductive substrate 110, and the heat sinkelements 130, 140, 150, 160, 170 and 180. In some embodiments, theaforementioned antenna structure further includes at least one of thefirst conductive sidewall 121 and the second conductive sidewall 122.That is, the heat dissipation device 100 can not only remove excess heatbut also provide the function of wireless communication.

The first conductive sidewall 121, the heat sink elements 130, 140, 150,160, 170 and 180, and the second conductive sidewall 122 may all besubstantially perpendicular to the conductive substrate 110.Furthermore, the first conductive sidewall 121, the heat sink elements130, 140, 150, 160, 170 and 180, and the second conductive sidewall 122may be substantially parallel to each other. For example, any twoadjacent elements from among the first conductive sidewall 121, the heatsink elements 130, 140, 150, 160, 170 and 180, and the second conductivesidewall 122 may substantially be the same distance apart, but they arenot limited thereto.

The feeding element 190 is coupled to a signal source 199. For example,the signal source 199 may be an RF (Radio Frequency) module. Theaforementioned antenna structure can be directly excited by the feedingelement 190, or can be excited by the feeding element 190 using acoupling mechanism. In some embodiments, the feeding element 190 isintegrated with the signal source 199, and they are implemented with acoaxial cable, a microstrip line, or an FPC (Flexible Printed CircuitBoard).

In some embodiments, the heat dissipation device 100 further includes aconductive ramp element 123. The conductive ramp element 123 is disposedon the conductive substrate 110, and is configured to support and fixthe heat sink elements 130, 140, 150, 160, 170 and 180 in such a waythat terminals 131, 141, 151, 161, 171 and 181 of the heat sink elements130, 140, 150, 160, 170 and 180 can be aligned with each other. Forexample, the terminals 131, 141, 151, 161, 171 and 181 of the heat sinkelements 130, 140, 150, 160, 170 and 180 may be positioned on the sameplane E1. In addition, the terminals 131, 141, 151, 161, 171 and 181, afirst terminal 121-T of the first conductive sidewall 121, and a secondterminal 122-T of the second conductive sidewall 122 may be aligned witheach other, and they are all positioned on the same plane E1.Furthermore, the heat sink elements 130, 140, 150, 160, 170 and 180 maybe further coupled through the conductive ramp element 123 to theconductive substrate 110. It should be understood that the conductiveramp element 123 is an optional component. In alternative embodiments,the conductive ramp element 123 is removable, so that the heat sinkelements 130, 140, 150, 160, 170 and 180 may be coupled directly to theconductive substrate 110, respectively.

Since the heat sink elements 130, 140, 150, 160, 170 and 180 havedifferent lengths, the first conductive sidewall 121, the heat sinkelements 130, 140, 150, 160, 170 and 180, and the second conductivesidewall 122 can define a plurality of open slots 124, 123, 144, 154,164, 174 and 184 with different lengths. For example, each of the openslots 124, 123, 144, 154, 164, 174 and 184 may have an open end and aclosed end.

With respect to the antenna theory, since the open slots 124, 123, 144,154, 164, 174 and 184 are excited to generate a plurality of resonantmodes with different frequencies, the antenna structure of the heatdissipation device 100 is capable of covering a relatively largeoperation bandwidth. Specifically, the open slots 124 and 134 with shortlengths correspond to relatively high-frequency bands, the open slots144, 154 and 164 with median lengths correspond to relativelymedian-frequency bands, and the open slots 174 and 184 with long lengthscorrespond to relatively low-frequency bands.

In some embodiments, the antenna structure can cover a first frequencyband and a second frequency band. The first frequency band may be from2400 MHz to 2500 MHz. The second frequency band may be from 3100 MHz to7125 MHz. Therefore, the antenna structure of the heat dissipationdevice 100 can support the wideband operations of conventional WLAN(Wireless Local Area Networks) and the next-generation 5G communication.With the design of the invention, the antenna structure for wirelesscommunication is integrated with the heat dissipation device 100, andtherefore the whole device size can be effectively reduced.

FIG. 2A is a perspective view of a heat dissipation device 200 accordingto an embodiment of the invention. FIG. 2B is a sectional view of theheat dissipation device 200 according to an embodiment of the invention(along a sectional line LC2). FIG. 2C is a sectional view of the heatdissipation device 200 according to an embodiment of the invention(along another sectional line LC3). Please refer to FIG. 2A, FIG. 2B andFIG. 2C together. FIG. 2A, FIG. 2B and FIG. 2C are similar to FIG. 1Aand FIG. 1B. In the embodiment of FIG. 2A, FIG. 2B and FIG. 2C, aplurality of heat sink elements 230, 240, 250, 260, 270 and 280 of theheat dissipation device 200 have a plurality of notches 236, 246, 256,266, 276 and 286, respectively. For example, each of the heat sinkelements 230, 240, 250, 260, 270 and 280 may substantially have aU-shape, and each of the notches 236, 246, 256, 266, 276 and 286 maysubstantially have a rectangular shape. The notches 236, 246, 256, 266,276 and 286 may have different lengths. Specifically, the notches 236and 246 may have relatively short lengths, the notches 256 and 266 mayhave median lengths, and the notches 276 and 286 may have relativelylong lengths. In addition, the notches 236, 246, 256, 266, 276 and 286may be aligned with each other, and they may all be substantiallyarranged in the same straight line (e.g., along the direction of thesectional line LC3). However, the invention is not limited thereto. Inalternative embodiments, each of the notches 236, 246, 256, 266, 276 and286 substantially has a semi-circular shape, a triangular shape, or asquare shape.

Similarly, the heat sink elements 230, 240, 250, 260, 270 and 280 havedifferent lengths, and they are all positioned between the firstconductive sidewall 121 and the second conductive sidewall 122. Thefirst conductive sidewall 121, the heat sink elements 230, 240, 250,260, 270 and 280, and the second conductive sidewall 122 arerespectively coupled to the conductive substrate 110 (e.g., through theconductive ramp element 123). An antenna structure is formed by thefeeding element 190, the conductive substrate 110, and the heat sinkelements 230, 240, 250, 260, 270 and 280. In some embodiments, theaforementioned antenna structure further includes at least one of thefirst conductive sidewall 121, the second conductive sidewall 122, andthe conductive ramp element 123. Since the heat sink elements 230, 240,250, 260, 270 and 280 have different lengths, the first conductivesidewall 121, the heat sink elements 230, 240, 250, 260, 270 and 280,and the second conductive sidewall 122 can define a plurality of openslots 224, 223, 244, 254, 264, 274 and 284 with different lengths. Eachof the open slots 224, 223, 244, 254, 264, 274 and 284 may have an openend and a closed end.

The antenna structure of the heat dissipation device 200 can be directlyexcited or excited using a coupling mechanism by the feeding element 190and the signal source 199. FIG. 3A is a diagram of a direct excitationmechanism of the antenna structure according to an embodiment of theinvention. In the embodiment of FIG. 3A, the feeding element 190directly touches one or more of the heat sink elements 230, 240, 250,260, 270 and 280 (e.g., the heat sink elements 250 and 260 at the middleposition). FIG. 3B is a diagram of a coupling excitation mechanism ofthe antenna structure according to an embodiment of the invention. Inthe embodiment of FIG. 3B, the feeding element 190 is adjacent to butdoes not directly touch one or more of the heat sink elements 230, 240,250, 260, 270 and 280 (e.g., the heat sink elements 250 and 260 at themiddle position). It should be noted that the term “adjacent” or “close”over the disclosure means that the distance (spacing) between twocorresponding elements is shorter than a predetermined distance (e.g., 5mm or shorter), but often it does not mean that the two correspondingelements are touching each other directly (i.e., the aforementioneddistance/spacing therebetween is reduced to 0). For example, a firstcoupling gap GC1 may be formed between the feeding element 190 and theheat sink element 250, and a second coupling gap GC2 may be formedbetween the feeding element 190 and the heat sink element 260, but theyare not limited thereto. The direct excitation mechanism and thecoupling excitation mechanism as described above do not affect theradiation performance of the antenna structure.

It should be noted that the notches 236, 246, 256, 266, 276 and 286arranged in the same straight line are considered as a coupling channel,which helps to improve the transmission of electromagnetic energy andincrease the operation bandwidth of the antenna structure. Furthermore,the incorporation of the notches 236, 246, 256, 266, 276 and 286 canalso increase the effective resonant lengths of the heat sink elements230, 240, 250, 260, 270 and 280, thereby further reducing the size ofthe antenna structure.

FIG. 2D is a diagram of resonant paths of the antenna structure of theheat dissipation device 200 according to an embodiment of the invention.As shown in FIG. 2D, the antenna structure of the heat dissipationdevice 200 has a low-frequency resonant path PA1, a high-frequencyresonant path PA2, and a coupling resonant path PA3. The low-frequencyresonant path PA1 mainly consists of relatively long heat sink elements,and it corresponds to the aforementioned first frequency band. Thehigh-frequency resonant path PA2 mainly consists of relatively shortheat sink elements, and it corresponds to the aforementioned secondfrequency band. The coupling resonant path PA3 is configured tofine-tune the impedance of both the first frequency band and the secondfrequency band as described above, so as to optimize the antennaradiation performance.

FIG. 4A is a diagram of return loss of the antenna structure of the heatdissipation device 200 according to an embodiment of the invention. Thehorizontal axis represents the operation frequency (MHz), and thevertical axis represents the return loss (dB). FIG. 4B is a diagram ofradiation efficiency of the antenna structure of the heat dissipationdevice 200 according to an embodiment of the invention. The horizontalaxis represents the operation frequency (MHz), and the vertical axisrepresents the radiation efficiency (%). According to the measurement ofFIG. 4A and FIG. 4B, the antenna structure of the heat dissipationdevice 200 can support at least the wideband operations of thenext-generation 5G communication. Other features of the heat dissipationdevice 200 of FIG. 2A, FIG. 2B and FIG. 2C are similar to those of theheat dissipation device 100 of FIG. 1A and FIG. 1B. Accordingly, the twoembodiments can achieve similar levels of performance.

FIG. 5A is a perspective view of an HMD (Head Mounted Display) 500according to an embodiment of the invention. In the embodiment of FIG.5A, the aforementioned heat dissipation device 100 (or 200) isapplicable to the HMD 500 supporting VR (Virtual Reality), AR (AugmentedReality) or MR (Mixed Reality). The HMD 500 includes a display portion510, a heat dissipation portion 520, and a headband portion 530. FIG. 5Bis a perspective view of the heat dissipation portion 520 of the HMD 500according to an embodiment of the invention. For example, theaforementioned heat dissipation device 100 (or 200) may be designed at afirst position 521 or a second position 522 on the heat dissipationportion 520 of the HMD 500, but it is not limited thereto. Because theheat dissipation portion 520 is an essential component of the HMD 500,such a design of the invention has the advantages of both small size andwide bandwidth by appropriately integrating the antenna structure withthe heat dissipation portion 520.

FIG. 6 is a sectional view of a heat dissipation device 600 according toan embodiment of the invention. The embodiment of FIG. 6 is similar toFIG. 1B, but it does not use any conductive ramp element. Thus, aplurality of heat sink elements 630, 640, 650 and 660 of the heatdissipation device 600 are directly coupled to the conductive substrate110, respectively. Since the heat sink elements 630, 640, 650 and 660have different lengths, the first conductive sidewall 121, the heat sinkelements 630, 640, 650 and 660, and the second conductive sidewall 122can define a plurality of open slots 624, 634, 644, 654 and 664 withdifferent lengths. In some embodiments, the length of each of the heatsink elements 630, 640, 650 and 660 is shorter than the length of eachof the first conductive sidewall 121 and the second conductive sidewall122. Each of the open slots 624, 634, 644, 654 and 664 has an open endand a closed end. According to practical measurements, the antennastructure of the heat dissipation device 600 can cover widebandoperations although terminals 631, 641, 651 and 661 of the heat sinkelements 630, 640, 650 and 660 are not aligned with each other on thesame plane. Furthermore, the terminals 631, 641, 651 and 661 are neitheraligned with the first terminal 121-T of the first conductive sidewall121 nor aligned with the second terminal 122-T of the second conductivesidewall 122. Other features of the heat dissipation device 600 of FIG.6 are similar to those of the heat dissipation device 100 of FIG. 1A andFIG. 1B. Accordingly, the two embodiments can achieve similar levels ofperformance.

FIG. 7 is a sectional view of a heat dissipation device 700 according toan embodiment of the invention. The embodiment of FIG. 7 is similar toFIG. 2C. However, in the heat dissipation device 700 of FIG. 7, aplurality of notches 736, 746, 756, 766, 776 and 786 of a plurality ofheat sink elements 730, 740, 750, 760, 770 and 780 have the samelengths. The notches 736, 746, 756, 766, 776 and 786 may be arranged inthe same straight line, thereby forming a coupling channel. In someembodiments, the length of each of the heat sink elements 730, 740, 750,760, 770 and 780 is shorter than the length of each of the firstconductive sidewall 121 and the second conductive sidewall 122.Furthermore, a plurality of terminals of the heat sink elements 730,740, 750, 760, 770 and 780 are neither aligned with the first terminal121-T of the first conductive sidewall 121 nor aligned with the secondterminal 122-T of the second conductive sidewall 122. Other features ofthe heat dissipation device 700 of FIG. 7 are similar to those of theheat dissipation device 200 of FIG. 2A, FIG. 2B and FIG. 2C.Accordingly, the two embodiments can achieve similar levels ofperformance.

The invention proposes a novel heat dissipation device for integrating aplurality of heat sink elements with an antenna structure. Generally,the invention has at least the advantages of small size, wide bandwidth,and whole minimized size, and therefore it is suitable for applicationin a variety of mobile communication devices with limited inner space.

Note that the above element sizes, element shapes, and frequency rangesare not limitations of the invention. An antenna designer can fine-tunethese settings or values according to different requirements. It shouldbe understood that the heat dissipation device of the invention is notlimited to the configurations of FIGS. 1-7. The invention may merelyinclude any one or more features of any one or more embodiments of FIGS.1-7. In other words, not all of the features displayed in the figuresshould be implemented in the heat dissipation device of the invention.

Use of ordinal terms such as “first”, “second”, “third”, etc., in theclaims to modify a claim element does not by itself connote anypriority, precedence, or order of one claim element over another or thetemporal order in which acts of a method are performed, but are usedmerely as labels to distinguish one claim element having a certain namefrom another element having the same name (but for use of the ordinalterm) to distinguish the claim elements.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it should be understood that the invention isnot limited to the disclosed embodiments. On the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. A heat dissipation device with a communicationfunction, comprising: a conductive substrate; a first conductivesidewall; a second conductive sidewall; a plurality of heat sinkelements, having different lengths, and positioned between the firstconductive sidewall and the second conductive sidewall, wherein thefirst conductive sidewall, the heat sink elements, and the secondconductive sidewall are respectively coupled to the conductivesubstrate; and a feeding element, coupled to a signal source, wherein anantenna structure is formed by the feeding element, the conductivesubstrate, and the heat sink elements.
 2. The heat dissipation device asclaimed in claim 1, wherein the first conductive sidewall, the heat sinkelements, and the second conductive sidewall are substantiallyperpendicular to the conductive substrate.
 3. The heat dissipationdevice as claimed in claim 1, wherein the first conductive sidewall, theheat sink elements, and the second conductive sidewall are substantiallyparallel to each other.
 4. The heat dissipation device as claimed inclaim 1, wherein the first conductive sidewall, the heat sink elements,and the second conductive sidewall define a plurality of open slots withdifferent lengths.
 5. The heat dissipation device as claimed in claim 4,wherein each of the open slots has an open end and a closed end.
 6. Theheat dissipation device as claimed in claim 4, wherein the open slotsare excited to generate a plurality of resonant modes with differentfrequencies, so that the antenna structure is capable of coveringwideband operations.
 7. The heat dissipation device as claimed in claim1, wherein the feeding element directly touches one or more of the heatsink elements.
 8. The heat dissipation device as claimed in claim 1,wherein the feeding element is adjacent to but does not directly touchone or more of the heat sink elements.
 9. The heat dissipation device asclaimed in claim 1, further comprising: a conductive ramp element,disposed on the conductive substrate, and configured to support the heatsink elements, so that terminals of the heat sink elements are alignedwith each other.
 10. The heat dissipation device as claimed in claim 1,wherein each of the heat sink elements substantially has a U-shape. 11.The heat dissipation device as claimed in claim 1, wherein each of theheat sink elements has a notch.
 12. The heat dissipation device asclaimed in claim 11, wherein each of the notches substantially has arectangular shape.
 13. The heat dissipation device as claimed in claim11, wherein the notches of the heat sink elements are substantiallyarranged in a same straight line.
 14. The heat dissipation device asclaimed in claim 1, wherein the heat dissipation device is applicable toan HMD (Head Mount Display) supporting VR (Virtual Reality), AR(Augmented Reality) or MR (Mixed Reality).
 15. The heat dissipationdevice as claimed in claim 1, wherein the antenna structure covers afirst frequency band and a second frequency band, the first frequencyband is from 2400 MHz to 2500 MHz, and the second frequency band is from3100 MHz to 7125 MHz.
 16. The heat dissipation device as claimed inclaim 1, wherein the antenna structure further comprises at least one ofthe first conductive sidewall and the second conductive sidewall. 17.The heat dissipation device as claimed in claim 1, wherein lengths ofthe heat sink elements are shorter than or equal to lengths of the firstconductive sidewall and the second conductive sidewall.
 18. The heatdissipation device as claimed in claim 1, wherein terminals of the heatsink elements, a first terminal of the first conductive sidewall, and asecond terminal of the second conductive sidewall are aligned with eachother and are positioned on a same plane.